Professional PCB Manufacturer
Professional PCB Manufacturer
An adequately made board enables precise determination of the connection network and assembly of elements. What types of printed circuit boards can be found on the market?
The world of electronics and other electrical appliances keeps evolving with new inventions added to the shelves just as the clock ticks
I see most printed circuit boards are green in color. I’ve seen some blue and yellow boards, but not so many – so I have a question: Why are most PCBs green? The above question is not only asked by electronics hobbyists but also questioned by engineers, so today let’s unravel the mystery.
PCB tombstoning is a defect that occurs during the reflow soldering process in surface-mount technology (SMT). It happens when one end of a small component, like a resistor or capacitor, lifts off the PCB and stands upright, resembling a tombstone.
In electronics, the terms VCC, VEE, VDD, and VSS are frequently used to describe different power supply voltages in circuits. These designations are essential for understanding the supply roles and the correct functioning of components like bipolar junction transistors (BJTs) and field-effect transistors (FETs).
In PCB manufacturing, engineers need a Bill of Materials (BOM) to organize every component required for their product. A BOM is a vital document for tracking parts, managing inventory, and ensuring production accuracy.
For the whole board positioning of the PCB circuit board and the reference symbols for the positioning of the fine-pitch devices, in principle, the QFP with a spacing of less than 0.65mm should be set at its diagonal position; the positioning reference symbols for the imposition PCB daughter board should be paired Use, place on the opposite corner of the positioned feature.
Blind vias and buried vias optimize space and functionality in multilayer PCBs, essential for high-density designs that enable complex and efficient layouts.
Explore the world of Electroless Nickel Immersion Gold PCBs. Understand their advantages, how they compare with HASL surface finishes, and their growing importance in various industries.
Choosing the right packaging form for integrated circuits is crucial in electronics. BGA and QFN offer distinct features and applications. Factors like pin density, thermal management, and repair ease guide the choice. Transitioning from QFN to BGA may address higher pin density, thermal needs, and market trends, balancing design and cost considerations.
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.
The pricing of a bespoke PCB and the variables that affect it will be covered in this article.
By continuing to use the site you agree to our privacy policy Terms and Conditions.
Recruit global agents and distributors Join us
